Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions
- Written by Media Outreach
Infineon and SCHWEIZER will showcase the 1200 V CoolSiC chip embedding technology at PCIM Europe 2023 in Nuremberg, at the Infineon booth 412 in Hall 7
The two companies have already demonstrated the potential of this new approach: They were able to embed a 48 V MOSFET in the PCB. This resulted in a 35 percent increase in performance. SCHWEIZER contributes to this success with its innovative p²Pack® solution which enables power semiconductors to be embedded in PCBs."With Infineon's 100 percent electrically tested standard cells (S-Cell), we can achieve high overall yields in the p² Pack manufacturing process," said Thomas Gottwald, Vice President Technology at Schweizer Electronic AG. "The fast-switching characteristics of the CoolSiC chips are optimally supported by the low-inductance interconnection that can be achieved with the p² Pack. This leads to increased efficiency and improved reliability of power conversion units such as traction inverters, DC-DC converters, or on-board chargers."
Infineon and SCHWEIZER will showcase the 1200 V CoolSiC chip embedding technology at PCIM Europe 2023 in Nuremberg, at the Infineon booth 412 in Hall 7. SCHWEIZER will also be at the trade fair (booth 410 in Hall 6).
Hashtag: #Infineon #Schweizer #Siliconcarbide #Automotive
The issuer is solely responsible for the content of this announcement.
